KIOXIA America, Inc. today announced that it has begun shipping evaluation samples(1) of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

What is the Market Size of Memory Wafer? BANGALORE, India, Feb. 24, 2026 /PRNewswire/ -- The Global Memory Wafer Market was valued at USD 58470 Million in the year 2024 and is projected to reach a ...

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced that it has begun sampling new Universal Flash Storage 1 (UFS) Ver. 4.1 embedded memory devices with ...

The debut of DeepSeek R1 sent ripples through the AI community, not just for its capabilities, but also for the sheer scale of its development. The 671-billion-parameter, open-source language model’s ...

KIOXIA America, Inc. today announced that it has begun sampling 1 new Universal Flash Storage 2 (UFS) Ver. 4.1 embedded memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology.

The rapid rise of artificial intelligence (AI) is reshaping not just software and services but also the very hardware that powers these technologies. As AI models grow larger and more complex, their ...