The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

For decades, optical inspection has been the primary method for process control in fabs. However, the move to multi-level ...

As semiconductor manufacturers aim to produce devices at the 5-nanometer node, the ability to find tiny defects created inadvertently during the fabrication process becomes harder. In addition, there ...

ATPG targets faults at IC-gate boundaries, but 50% of defects are located within cells. Learn how cell-aware ATPG and user-defined fault models help to ferret out these hard-to-squash bugs.

With the continuous optimization of China's energy structure and the rapid expansion of natural gas consumption, high grade steel large diameter gas pipelines have become increasingly indispensable in ...