EDN

Novellus Develops Advanced Copper Seed Technology for Through-Silicon-Via (TSV) Packaging

SAN JOSE, Calif., March 8 /PRNewswire-FirstCall/ — Novellus Systems (Nasdaq: NVLS) today announced that it has developed a new, advanced copper barrier-seed ...
Science Daily

Seeing the light: Scientists unlock seed germination process

Scientists have identified a key gene that helps seeds decide whether to germinate. The MFT gene stops seeds germinating in the dark or under shady conditions, where their chances of survival would be ...
EDN

Novellus develops advanced copper seed technology for through-silicon-via (TSV) packaging

San Jose, California – March 8, 2010 – Novellus Systems (NASDAQ: NVLS) today announced that it has developed a new, advanced copper barrier-seed physical vapor deposition (PVD) process for the ...