HBM4 deal; Iran War impacts; restart of H200 processors for China; SK hynix's memory prediction; TFLN photonics deal; test ...

The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers ...

Based CPU-GPU Architecture with Replay-Driven Simulation and Emulation,” was published by researchers at Intel, Nvidia and Synopsys. Abstract “Integration of CPU and GPU technologies is a key enabler ...

Liquid cooling is proving effective at cooling high-power chips, such as GPUs, but it’s creating thermal issues for other nearby chips that previously benefited from the airflow ...

High‑NA EUV's reduced field size is driving new innovation in optical proximity correction and mask synthesis.

A new technical paper, “Performance Analysis of Edge and In-Sensor AI Processors: A Comparative Review,” was published by University of Austria and ETH Zurich. Abstract “This review examines the ...

AI data centers are starting to replace copper with co-packaged optics in an effort to reduce energy consumed per bit and ...

As ATE systems become increasingly complex and data-intensive, traditional rule-based optimization methods struggle to keep ...

Inferencing at the edge has very different needs than training large language models or large-scale inferencing in AI data ...

Moore’s Law has shifted toward advanced packaging over the past few years, but the limits of that approach are just now coming into focus. AI and HPC designs are growing larger ...

AI workloads require rapid access to vast amounts of data, made possible by integrating HBMs. This approach, combining two, ...

A new technical paper, “Towards Structured Training and Validation of AI-based Systems with Digital Twin Scenarios,” was ...