Solstice Max is a flexible, modular platform that integrates advanced plating, photoresist stripping, and wet etching processes to enhance fab efficiency and reduce cost of ownership. ClassOne ...

The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...

Abstract: Burrs, cracks, and scratches are often produced on silicon carbide (SiC) wafers during various processing stages, such as rolling and cutting. To address these challenges, edge grinding ...

Spring Batch provides developers with two separate approaches to batch programming: 1. Process a small batch of records in a single step using a Tasklet. 2. Process a large batch of records in chunks ...

Infineon is the first semiconductor manufacturer to master handling and processing of ultra-thin 20-micrometer power semiconductor wafers. Infineon Technologies AG has disclosed the subsequent ...

An experimental ‘no-GIL’ build mode in Python 3.13 disables the Global Interpreter Lock to enable true parallel execution in Python. Here’s where to start. The single biggest new feature in Python ...

ClassOne Technology announced that Georgia Institute of Technology (Georgia Tech) has selected a Solstice® S8 single-wafer processing system for its advanced packaging ...

Abstract: We present a wet wafer surface processing chain model that allows process engineers to optimize their technological processes concerning total process time. As an example, we study the water ...